Our FEA experts will guide you solve your product engineering challenges either if it is purely structural challenge or if there is a multi-physics challenge (i.e. thermal, shock and structural):
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Stress analysis (stress-strain tensors, force-displacement, deformation) of parts or assemblies
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Static and dynamic analysis (vibration, shock, modal, drop/tumble test)
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Linear and non-linear deformation (i.e. elastic and plastic deformation)
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Life cycle, fatigue, strength and durability
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Heat, Thermal and CFD analysis
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Crack and failure propagation
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3D printing and AM (additive Manufacturing) process optimization
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Injection Molding analysis of various grades of Polymers to minimize manufacturing inherent flaws
Some of our projects include:
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Femur bone implant: non-linear analysis of a femur bone implant to replace the fractured bone (biomedical industry)
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Guide Catheter: Finite element simulation of a guide catheter movement (biomedical applications)
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Smart glass: root causing the crack problem in the drop test of a smart frame glass (AR/VR consumer electronics)
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Headphone/ear phone: designing metal alloy parts of an earphone to address cyclic loading failure
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Tablet: housing crack failure optimization during drop and tumble tests
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Smart ring (sport’s wear): Managed design optimization of permanent plastic deformation of several metal alloys during assembly of micro-electronic components
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Smart speaker: Optimized polymer cracks in plastic parts coming in contact with consumers’ skin
Other FEA/FEM capabilities include:
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Static buckling of structures (micro/ macro level analysis)
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Nonlinear Stress-Strain analysis in various range of materials such as elastoplastic, hyperelastic, temperature dependent, and coupled physics (piezoelectric)
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Nonlinear contact of structures considering aspects such as bolt preload or initial gaps/ interferences
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Parametric Design to determine the sensitivity of a system to specific variables
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Optimization of a system to meet specific design criteria
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HPC (High Performance Computing) capabilities
