Simply manage Root Cause of failure (such as crack and craze propagation issues) in your devices by allowing our pioneers to take ownership of the design, characterization and modeling of your components. Our team will assist you how to identify and root cause failure via various methodologies such as:
- Injection Mold simulation
- Built-in stress-strain level assessment
- Fatigue analysis
- Creep analysis
- Friction and wear mechanism in metals or ceramics
- Mitigating crack risk by minimizing stress concentration, optimizing geometry, changing build parameters and variables
- Conducting the necessary metrology to tackle the real Root Cause of the failure (CT Scan, 3D optical imaging, tactile probing, SEM, etc). We don’t own these FA tools but we can assist you in choosing the right tools and the vendors. This will significantly assist you in verifying your FEA simulations against each failure mode in your device.
