Our engineering team will assist in designing and characterizing your smallest micro chips either as an individual component (IC, SOC, MEMS, etc) or as part of a microelectronic assembly such as FPC (Flex Printed Circuit) or PCBA (Printed Circuit Board Assembly).
From the intricate behavior of transistors in an IC to the robust symphony of components on a PCBA, our engineering team dives deep into the world of microelectronics, guiding you every step of the way. Whether you’re sculpting a standalone microsystem or designing a complex assembly, we’re your design and characterization partners. We meticulously analyze each layer, ensuring optimal performance and reliability of your devices.
Our design can assist you address failure in your devices such as de-lamination, bonds failure, components loss of integrity, over heating, shorting and many other types of failure that your product confronts. Fortunately, our expertise extends beyond mere design. We dive deep to assist you conduct FMEA and RC (Root Cause) potential failure modes, identifying vulnerabilities and crafting solutions that improves your devices against unexpected failures.
